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		<title>途径 on Five-Star Infrared Heating Systems</title>
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				<title>硅通孔加热器</title>
				<link>http://ir-heater-star.com/zh/posts/tsv-through-silicon-via-heater/</link>
				<pubDate>Thu, 18 Jun 2026 00:59:21 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heater-star.com/images/c4487c91a5d0bd93963bf8b3a19ba704.png&#34; alt=&#34;硅通孔加热器&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;在芯片制造过程中，TSV的刻蚀和填充工艺决定了几乎不存在温度变化的空间。如果光阻烘烤时的温度波动达到2摄氏度，就会导致关键尺寸控制失灵，进而使通孔填充层中出现空洞。而TSV加热器则能将整个晶圆上的温度控制在±0.1摄氏度范围内，确保整个工艺过程的稳定性。&lt;/p&gt;</description>
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